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Bonding X-ray inspection equipment - List of Manufacturers, Suppliers, Companies and Products

Bonding X-ray inspection equipment Product List

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IC wire bonding X-ray inspection device 'LFX-1000R'

This is an introduction to a device that uses X-rays to perform radiographic inspection of the internal condition of reel-shaped IC components.

The IC wire bonding X-ray inspection device "LFX-1000R" is a device that uses X-rays to perform radiographic inspection of the internal condition of reel-type IC components. While winding the ICs from the tape reel, it automatically inspects the connection status of the wire bonding for each individual IC (Good/NG judgment). The compatible reel dimensions range from 180 to 380 mm. 【Features】 ■ Compatible reel dimensions: 180 to 380 mm ■ Radiographic inspection of the internal condition of IC components using X-rays ■ Automatic inspection of the connection status of wire bonding for each individual IC ■ A lead frame compatible type "LFX-1000" is also available *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment

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Wire bonding X-ray inspection device

We introduce a wire bonding X-ray inspection device capable of sorting and discharging based on defective content!

Our company is advancing the development of X-ray inspection equipment that meets the needs of various industries, primarily based on the image processing technology we have cultivated over many years. The "Wire Bonding X-ray Inspection Equipment" conducts inspections of the wire shapes inside the package after resin molding using X-ray images. It is capable of sorting and discharging based on the type of defect. 【Features】 ■ Capable of sorting and discharging based on the type of defect ■ Inspections of wire shapes, foreign objects, and voids *For more details, please refer to the related link page or feel free to contact us.

  • X-ray inspection equipment

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