Wire bonding X-ray inspection device
We introduce a wire bonding X-ray inspection device capable of sorting and discharging based on defective content!
Our company is advancing the development of X-ray inspection equipment that meets the needs of various industries, primarily based on the image processing technology we have cultivated over many years. The "Wire Bonding X-ray Inspection Equipment" conducts inspections of the wire shapes inside the package after resin molding using X-ray images. It is capable of sorting and discharging based on the type of defect. 【Features】 ■ Capable of sorting and discharging based on the type of defect ■ Inspections of wire shapes, foreign objects, and voids *For more details, please refer to the related link page or feel free to contact us.
- Company：英光産業
- Price：Other
